Chip on Board (COB) is a mainstream packaging technology, it has many advantages when compared to the hermetically sealed packaging. COB utilizes high precision die and wire bonders to attach chips and subcomponents to a PCB electronically. 

Optical coupling, with input and output optical fibers, is then achieved with lens arrays and waveguide structures. The entire process can be highly automated and, because of the precise positioning of chips on the two-dimensional PCB, the difficulty of optical alignment is significantly reduced compared to Free Space Optical (FSO) packaging. This makes COB the preferred choice of packaging technology for high volume manufacturing of transceiver modules.

Our Mature and experienced high-speed COB manufacturing technology provides our customers a cost-effective solution with high reliable, excellent consistence on optical performances. The entire process can be highly automated and, because of the precise positioning of chips on the two-dimensional PCB, the difficulty of optical alignment is significantly reduced compared to FSO packaging. This makes COB the cost-effective and the preferred choice of packaging technology for high volume manufacturing of transceiver modules.